By Madhavan Swaminathan,Ki Jin Han
3D Integration is being touted because the subsequent semiconductor revolution. This e-book presents a finished insurance at the layout and modeling elements of 3D integration, in relatively, concentrate on its electric habit. having a look from the point of view the Silicon through (TSV) and Glass through (TGV) expertise, the booklet introduces 3DICs and Interposers as a expertise, and offers its software in numerical modeling, sign integrity, energy integrity and thermal integrity. The authors underscored the potential for this expertise in layout alternate codecs and tool distribution.
- System Integration and Modeling Concepts
- Modeling of Cylindrical Interconnections
- Electrical Modeling of via Silicon Vias
- Electrical functionality and sign Integrity
- Power Distribution, go back course Discontinuities and Thermal Management
- Alternate equipment for energy Distribution
Readership: Graduate scholars, teachers, researchers in electric and electronics engineering, laptop engineering, semiconductors and packaging.
Read or Download Design and Modeling for 3D ICs and Interposers: 2 (WSPC Series in Advanced Integration and Packaging) PDF
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Additional info for Design and Modeling for 3D ICs and Interposers: 2 (WSPC Series in Advanced Integration and Packaging)
Design and Modeling for 3D ICs and Interposers: 2 (WSPC Series in Advanced Integration and Packaging) by Madhavan Swaminathan,Ki Jin Han